[產品資訊] 顯微鏡頭 Machine Vision Objectives

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Opto was founded in 1980 and since then has become a leading supplier of specialist objectives for Machine Vision. We take pride in having built our reputation on designing the highest quality optical equipment exactly fitting the application! Our commitment is to offer highly efficient optomechanical solutions, ‘reduced to the needs’ of the application, and exactly meeting the performance and budgetary needs of your program. With quality and reliability at the heart of our business, we care for our solutions from development, through production, assembly and after delivery. With many long term customers we invent their unique selling points for many product generations.

Bi-Telecentric Mega Pixel Objectives

• Large field depth
• No perspective error with three dimensional objects
• Homogeneous image acquisition with high
• light sensitivity
• High-resolution object- and image-side telecentric imaging
• Universal C-Mount lenses
• QuadraMount available for easy integration

Applications & Markets

• Measurement of profiles
• Determination of diameters
• Adjustment of electronic components
• Measurement of objects with large height
• C-Mount cameras supported up to 2/3“
• High precision design

Bi-Telecentric Mega Pixel Objectives

• Large field depth
• No perspective error with three dimensional objects
• Homogeneous image acquisition with high
• light sensitivity
• High-resolution object- and image-side telecentric imaging
• Universal C-Mount lenses
• QuadraMount available for easy integration

Applications & Markets

• Measurement of profiles
• Determination of diameters
• Adjustment of electronic components
• Measurement of objects with large height
• C-Mount cameras supported up to 2/3“
• High precision design

Modular C-Mount Objectives

• Modular compact C-Mount objectives
• Economical, high-performance solution
• High magnification with large working distances
• High resolution microscope-grade optics

Applications & Markets

• With coaxial illumination perfect for many metallurgical applications
• Integration in AOI machines for control of product positioning
• Bond inspection for dies and wires inside semiconductor machines
• Online manufacturing control for high-speed applications
• Structures on wafers die, and boards in semiconductor applications
• Metallurgical examinations such as hardness testing
• Biological applications including tracking of protein or cell growth in well plates

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